Friday, December 4, 2020

Huawei Could Launch Two Kirin SoC With One Integrated 5G Chipset

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Pravin Kr. Chandra
A mechanical engineer by profession and a gadget freak by passion.

In order to beat Qualcomm, Samsung and Apples’ offerings, Huawei has been launching one flagship SoC per year. And in the last few years, Huawei’s Hisilicon has managed to manufacture such chips that can compete with Qualcomm, Samsung, and Apple’s chipset. Now, Chinese Tech Giant Huawei’s Hisilicon who has the plan to launch two new SoC in the market in 2019. It is also a rumor that the company could come up with an integrated 5G chipset.

As we know, Huawei is going to launch its flagship Mate 30 series in September and the report speculates That one of which may be a special 5G edition of Mate 30 series smartphone. This special edition of Mate 30 series may include This integrated 5G Chipset.

Integrated 5G Modem

Read Also: – Samsung Patents A Unique Design Patent For 3-in-1 smartphone With Three Extendable Screen

An interview with Nikkei Asian Review, the company said that its new mobile chipset with an integrated 5G modem In between October- December of 2019. If it is so then Huawei Hisilicon will be the first to launch the world’s first 5G integrated Modem chip in the market for the consumers.

Recent News: –

However, Qualcomm also said that they will bring 5G integrated chip in mid-2020. Further, the report also added that Huawei it is a target to selling 10 million 5G smartphones at the end of this year. As the company’s first 5G smartphone, the Mate 20 X 5G is already selling in Europe and soon will be available in China in August. The targeted goal of the company may achieve.

As per previous speculates, Huawei Mate 30 Pro will be powered by kirin 985 SoC with a Hisilicon 5000 5G modem. It is also a rumor it will feature 90 Hz refresh rate for the display. If we talking about the camera, I will come with 5x optical zoom and 50x digital zoom.

Read Also: – Oppo New Phone With Extremely Curved Edge “Waterfall Screen” Show Off By The Company

Source: – 1, 2

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